[AKEI NEWSLETTER 25호]It is going to introduce its technology for the "2021 Inte…
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It is going to introduce its technology for the "2021 International Electronic Circuit and Mounting Industry Exhibition" board.
Currently,
more than 175 mobile carriers around the world are providing commercial 5G
services. The 2021 International Electronic Circuit and Mounting Industry
Exhibition showed various trends in the spread of these services.
YMT, a company participating in the
International Electronic Circuit and Mounting Industry Exhibition, introduced a
range of foil products with high-frequency 5G surface treatment (Surface
Finishing for high Frequency 5G) technology and electroless copper plating
methods targeting the 5G era.
In addition, YMT introduced a foil product
line using the Nanotus (Nonetching Low Profile Roughness Chemicals) method, a
wireless copper plating method.
Nanotus is a pretreatment method that
increases adhesion between a non-etched stacked, dry film (PSR) and a photo
solder resist (PSR), and an electroless copper plating method is applied, not a
roughness method through etching.
Samsung Electro-Mechanics also introduced
products and technologies such as Large Body FCBGA (Flip-chip Ball Grid Array),
SiP Module (EDS), FCBGA (UTC, SC), BGA (UTCSP, and FCCSP) at the KPCA Show
2021.
Recently, demand for FCBGA substrates has been
rapidly growing in various applications that require high-speed signal
processing, such as AI, 5G, automobiles, servers, and networks.
At the same exhibition, LG Innotek also
introduced substrate products in three fields: "5GAiP (Antenna in Package)
substrate," "Package substrate," and "Tape substrate."